Problems to be paid attention to in high-frequency circuit board wiring

In order to make the design of the high-frequency circuit board more reasonable and have better anti-interference performance, the following aspects should be considered when designing the high-frequency circuit board.

1. Using the middle inner plane as the power and ground layer can play a shielding role, and can reduce parasitic inductance, shorten the length of signal lines, and reduce cross-interference between signals.

2. The wiring must be turned at a 45-degree angle to reduce the emission of high-frequency signals and the coupling between them.

3. The shorter the wire length, the better, and the shorter the parallel distance between the two wires, the better.

4. The smaller the number of vias, the better.

5. The wiring direction between layers should be vertical, that is, the top layer is the horizontal direction, and the bottom layer is the vertical direction, which can reduce the interference between signals.

6. Increasing grounded copper can reduce interference between signals.

7. Packing processing of important signal lines can significantly improve the anti-interference ability of the signal. Of course, the interference source can also be packaged to prevent interference with other signals.

8. The signal wiring cannot be looped and needs to be wired in a daisy chain.

9. Decoupling capacitor. Connect decoupling capacitors across the power supply section of the integrated circuit.

10. When the digital ground and analog ground are connected to the common ground wire, a high-frequency choke device should be connected, usually a high-frequency ferrite bead with a wire through the center hole.